NanoSlic® Stencil

NanoSlic® SMT Stencil

Precision. Non-stick. High Yield.

FP Stencil Sdn. Bhd. is exclusive licensee of NanoSlic® Coatings in Malaysia, Singapore, Philippines, Australia, and Batam, Indonesia from FCT.

NanoSlic® is the industry-leading coating that provides increased transfer efficiency up to 25%, low area ratio 0.50, improved print quality, reduced bridging, improved solder paste released, improved yield and reduced under-side cleaning cost. NanoSlic® stencils are engineered with a nano-coating surface treatment to deliver superior solder paste printing performance. Ideal for ultra-fine pitch components and high-density PCB assemblies, NanoSlic™ ensures consistent solder deposition, reduced defects, and easier cleaning.

A highly hydrophobic and oleophobic coating on surface and aperture walls that provides unprecedented improvements in transfer efficiency and print quality.

NanoSlic ® Long Life Coatings for high volume printing applications.

Key Characteristics

1. Nano-Coated Surface
   
   • Ultra-smooth, low-energy surface for superior solder paste release.
   • Hydrophobic and oleophobic surface
2. Fine-Pitch Compatibility
   
   • Supports ultra-small components: 01005, 0201, micro-BGA, CSP.
3. High Printing Accuracy
   
   • Uniform solder deposition, ensuring precise paste volume.
4. Defect Minimization
   
   • Reduces bridging, tombstoning, and insufficient solder issues.
5. Low Maintenance
   
   • Non-stick surface lowers cleaning frequency and increases uptime.
6. Durable & Long-Lasting
   
   • Nano-coating protects stencil apertures for high-volume production.
7. Optimized for Complex PCBs
   
   • Ideal for high-density boards and mixed-layout assemblies.