Frequently Asked Questions
NanoSlic® is a permanent SMT stencil coating designed to improve solder paste release performance in PCB stencil printing applications. It creates a highly hydrophobic and oleophobic surface, preventing solder paste from sticking to stencil aperture walls and underside surfaces.
This results in improved transfer efficiency, cleaner printing, and more stable SMT process performance.
NanoSlic® provides multiple advantages for SMT stencil printing, including:
- Improved solder paste release efficiency
- Reduced stencil underside contamination
- Fewer printing defects such as bridging and insufficient solder
- Reduced cleaning frequency and downtime
- Improved process stability in high-volume SMT production
These benefits help improve overall production yield and line efficiency.
NanoSlic® modifies the stencil surface energy, making it extremely low adhesion to solder paste. This allows solder paste to release more cleanly from stencil apertures, improving print consistency and reducing variation between prints.
Yes. NanoSlic® significantly reduces solder paste build-up on the stencil underside and aperture walls. This results in less frequent cleaning cycles, helping reduce machine downtime and improving SMT line productivity.
Yes. NanoSlic® is especially beneficial for fine-pitch, micro BGA, and high-density PCB designs, where clean aperture release is critical for consistent solder paste deposition.
NanoSlic® coating is compatible with:
- Laser-cut stainless steel SMT stencils
- Fine-pitch and micro-aperture stencils
- Framed and frameless stencil formats
- Step stencils (multi-thickness designs)
Yes. NanoSlic® is a permanent stencil surface treatment designed to last for the lifetime of the stencil under normal SMT production conditions. It does not require reapplication during use.
Yes. NanoSlic® is widely used in high-volume SMT manufacturing environments where consistent print quality and reduced downtime are critical.
No. NanoSlic® forms an ultra-thin molecular layer that does not significantly alter stencil thickness or aperture geometry. It maintains dimensional accuracy while improving surface performance.
NanoSlic® is designed as a durable coating for long-term SMT production use. Under normal operating conditions, it maintains performance throughout the stencil lifecycle.
NanoSlic® is widely used in advanced PCB assembly and SMT manufacturing to achieve:
- Higher print efficiency
- Improved first-pass yield
- Reduced downtime and maintenance
- More stable solder paste deposition
- Better performance in fine-pitch applications
By enhancing stencil surface properties, NanoSlic® supports high-reliability, high-volume electronics manufacturing environments.