A precision-engineered stainless steel stencil used in SMT processes to ensure controlled and uniform solder paste transfer onto PCB pads prior to component placement.
Designed for stability and repeatability, our SMT Standard Laser Cut Stencils deliver accurate solder paste deposition across a wide range of PCB assemblies—supporting efficient, high-yield production.
Technical Specifications
- Material: Stainless Steel (SUS304 / SUS301) & Nickel Blank
- Thickness Range: 0.025 mm – 0.300 mm
- Aperture Geometry: Square, Rectangular, Circular, Custom
- Surface Treatment (Optional): Electropolishing & Aculon Nano Coating
Quality Commitment
Each stencil undergoes strict process control to ensure dimensional accuracy, aperture consistency, and surface quality—meeting the demands of precision electronics manufacturing.
Semi Fine Grain (SFG) SUS Stencil
High performance SUS 304 material with small grain size of 2-5 μm with smooth surface at optimal cost
Fine Grain (SUS Stencil)
Finer grain structure of less than 2 μm that effectively reduces burrs on the apertures’ wall surface
Nickel Blank Stencil
High performance laser cut stencil designed to suit fine feature printing with excellent durability